Tesla Blatná, a.s. has thin-film and thick-layer technology, which is located in clean rooms of ISO 7 and 8 purity class according to ČSN ISO 14644-1. Spraying and steaming equipment, photolithography, trimming laser, diamond saw for cutting corundum and silicon substrates are available in the workplace, and the workplace is equipped with screen printing for thick-film applications.
If necessary, we can offer you assistance in developing or testing your products.
Examples of products
We are able to sputter the Au, Pt, Ta, NiCr, Ti, W layers on a wide range of substrates from corundum, silicon to flexible Kapton film. Standard sizes of substrates for spraying are up to 10 x 10 cm.
The laser is ideal for setting and testing thin-film resistors, resistive nuts and other thin-film applications. The laser (3 W Q-switched YAG laser at 532 nm) vaporizes the thin metal layer in the designed meander to achieve the required resistance values. The system allows trimming in the 0.1 Ω-1000 M Ω range.
The Diamond Circular Saw Cuts Substrates to 4 "Dimensions. The saw can cut both corundum and silicon substrates.
We use photolithography to prepare structures for further process-lift-off or ion-milling. Workplace equipment allows us to implement structures with a resolution of 5 μm. We are able to graphically process customer designs according to the photolithography requirements (drawings for the production of chrome masks).
The device allows spot welding of wire 0.2 to 0.3 mm in diameter and 10 mm to 100 mm in length on metal layers prepared with thin film or thick film technology.
The dosing device is designed to accurately apply conductive or dielectric traps. For sensor applications, it is used to apply and fix the contacts by dielectric paste, reinforcing contact surfaces with conductive paste, etc. Another option is selective application of sensitive materials.
- wet chemical etching processes
- galvanic reinforcement of gold and nickel
- humidity chamber